By Ken Gilleo
While MEMS expertise has advanced swiftly, commercialization of MEMS has been hindered through packaging know-how limitations and prices. one of many key concerns within the industrialization of MEMS, MOEM and eventually Nanoelectrical units is the advance of acceptable packaging ideas for the security, meeting, and long-term trustworthy operation. This booklet carefully examines the homes of the fabrics utilized in MEMS and MOEN meeting then evaluates them by way of their routing, electric functionality, thermal administration and reliability. With this as a place to begin, the publication strikes directly to talk about complicated packaging equipment equivalent to: molded thermoplastic applications for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
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MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes (Nanoscience and Technology) by Ken Gilleo