Ken Gilleo's Area Array Packaging Handbook: Manufacturing and Assembly PDF

By Ken Gilleo

*Covers layout, packaging, building, meeting, and alertness of all 3 methods to quarter Array Packaging: Ball Grid Array (BGA), Chip Scale package deal (CSP), and turn Chip (FC) *Details the professionals and cons of every expertise with various purposes *Examines packaging ramifications of excessive density interconnects (HDI)

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Area Array Packaging Handbook: Manufacturing and Assembly (McGraw-Hill Handbooks) by Ken Gilleo

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